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Before you may submit any invention information, you must read and accept all the terms and conditions in the Agreement. This Agreement is effective upon acceptance for new users and terms and conditions may be updated from time to time without notice to user.
You hereby acknowledge:
I acknowledge that I am the owner of the invention information and am authorized to submit to company.
I acknowledge that the disclosure is being made on a NON CONFIDENTIAL basis, and that no confidentiality obligations or legal relationships whatsoever are created by this invention submission.
I acknowledge that I am free to make this submission and that by doing so I am not infringing any prior obligation of confidentiality.
I acknowledge that company may contact me for additional information and/or samples/prototypes if applicable.
I acknowledge that company may already be independently working on a similar technology as covered by my submission and that I will not therefore assert any intellectual property rights against company in this respect.
You hereby acknowledge:
I acknowledge that I am the owner of the invention information and am authorized to submit to company.
I acknowledge that the disclosure is being made on a NON CONFIDENTIAL basis, and that no confidentiality obligations or legal relationships whatsoever are created by this invention submission.
I acknowledge that I am free to make this submission and that by doing so I am not infringing any prior obligation of confidentiality.
I acknowledge that company may contact me for additional information and/or samples/prototypes if applicable.
I acknowledge that company may already be independently working on a similar technology as covered by my submission and that I will not therefore assert any intellectual property rights against company in this respect.